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Home > products > Hot Melt Adhesive Tape > Hot Melt Adhesive Tape Adhesive for attaching Chip Modules on PC and PVC Substrates

Hot Melt Adhesive Tape Adhesive for attaching Chip Modules on PC and PVC Substrates

Product Details

Place of Origin: Shenzhen City, Guangdong Province , China

Brand Name: Tunsing

Certification: SGS , ISO9001,ISO7816

Model Number: DS-4

Payment & Shipping Terms

Minimum Order Quantity: 20 rolls

Price: negotiable

Packaging Details: 100 yard in a roll, 1 rolls in a carton, or it's up on the customer's request

Delivery Time: 5-7days

Payment Terms: Western Union, T/T, PayPal

Supply Ability: 40000 Square meters per day

Get Best Price
Highlight:

hot melt adhesive film

,

thermal adhesive tape

Color:
Light Yellow
Proportion:
1.18±0.02g/cm³
Melting Range:
70-95℃ (Tunsing DSC 214)
Melt Flow Index:
75±25g/10min(ASTM D1238-04)
Hardness:
D 58±2 (Shore )
Release Protection:
Glassine Release Paper
Conventional Thickness:
0.055mm±0.008mm
Color:
Light Yellow
Proportion:
1.18±0.02g/cm³
Melting Range:
70-95℃ (Tunsing DSC 214)
Melt Flow Index:
75±25g/10min(ASTM D1238-04)
Hardness:
D 58±2 (Shore )
Release Protection:
Glassine Release Paper
Conventional Thickness:
0.055mm±0.008mm
Hot Melt Adhesive Tape Adhesive for attaching Chip Modules on PC and PVC Substrates

Hot Melt Adhesive Tape Adhesive for attaching Chip Modules on PC and PVC Substrates

 

Description:

The hot melt adhesive is used for embedding of contact smart cards. Excellent adhesion to PVC, PC, FR-4 and other materials.This product belongs to hot-melt tape with low and medium temperature properties. Very strong cohesion and good flexibility to ensure that no structural fracture will occur in the thrust and bending tests after bonding, while maintaining a balanced bond strength with the chip and the card base, and has excellent punchability. Meet the requirements of ISO7816 standard for chip package fastness.

 

Applications:

DS-4 is suitable for heat embedding of IC cards, SIM cards, financial social security cards, and contact bank cards.

Composition: Polyamide synthetic modification

Structure

Hot Melt Adhesive Tape Adhesive for attaching Chip Modules on PC and PVC Substrates 0

Physical Characteristics:

Colour

Light Yellow

Release Protection

Glassine Release Paper

Proportion

1.08±0.02g/cm³

Conventional Thickness

0.055mm±0.008mm

Melting Range

70-95℃ (Tunsing DSC 214)

Conventional Width

29.2mm

Melt Flow Index

75±25g/10min(ASTM D1238-04)

Conventional Length

200m

Hardness

D 58±2 (Shore )

Finished Product

0.055mm*29.2mm*200m

Recommended Bonding Conditions:

Mechanical Mold Temperature 140℃-160℃ Mechanical Mold Temperature 160℃-180℃
Adhesive Time 0.6S-1.2S Packing Time 0.6S-1.2S
Pressure 0.25-0.4mpa Pressure 0.25-0.4mpa

Hot Melt Adhesive Tape Adhesive for attaching Chip Modules on PC and PVC Substrates 1

 

 

Applications:
DS-5 is suitable for thermal packaging of IC card, SIM card, financial social security card and dual interface bank card

Hot Melt Adhesive Tape Adhesive for attaching Chip Modules on PC and PVC Substrates 2
 

 

 

Customer Feedback:

Hot Melt Adhesive Tape Adhesive for attaching Chip Modules on PC and PVC Substrates 3

 


Packing and Shipping:
Packing: 200m in roll, 20 rolls in case
Shipping: 5-7days by Express (DHL, FedEx, USP and so on) and by air, and 30-40 days by sea.

Hot Melt Adhesive Tape Adhesive for attaching Chip Modules on PC and PVC Substrates 4
 

 

Smart Cards India Expo 2018

Hot Melt Adhesive Tape Adhesive for attaching Chip Modules on PC and PVC Substrates 5


Why Choose Us
1, more than 10 years experience in production.
2, well-known products: Sichuan Famous Brand.
3, Good quality control in production process: Quality Service AAA Grade Credit Enterprise
4, Excellent quality and Competitive price, OEM is available.
5, Stable supply: an extensive range of stock.
6, The whole process from material to end products is under supervision.


FAQ:
Q1) . What is hot melt adhesive tape?
A: It is just a tape, and the basic material is release paper. But the tape is solid in room temperature, when reach its melt point, it is able to bond other materials, Different materials of hot melt adhesive tape have different performances and different usages, we need understand your products needs, then recommend you right products,
Q2).Do you accept OEM or ODM?
Yes ,we accept OEM and ODM, we are professional heat transfer material manufacturer ,having more than 10years domestic sale experience, we are able to assist you R&D new products. So if you need bonding some special materials, please don’t hesitate to let us know,
Q3).How do you ship the products?
If you are not urgent, we usually transport by sea in large quantity, which is the cheapest shipping way. And for samples and urgent cargo, we transport it by air or by express, as it is the fastest way etc,
Q4). Do you provide free sample? And how many days it will take?
Yes, of course.we provide free 3-5Y sample for your testing only need you to pay the shipping cost. We will make the sample within 3 working days and it will take 3-7days on the transportation., then you will have more confidence in our product quality and service,
Q5). How long is the lead time?
Sample lead time: 1-3 days
Bulk lead time: 7-20days(depends on order quantity),
Q6). How do I pay for my order?
We usually accept L/C ,T/T ,Western Union , Paypal.


 

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